SiC based Technology for High Power Electronics and Packaging Applications
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Journal of the Microelectronics and Packaging Society
سال: 2014
ISSN: 1226-9360
DOI: 10.6117/kmeps.2014.21.2.071